800W Reflow Oven,T-962 Reflow Soldering Station, PCB Board SMD SMT BGA Rework Station Tool With Hot Air Circulation Reflow Oven

Brand: XGPGBXGT

Features:

• Fully Automated Microcomputer Control – Completes the entire soldering process (preheating, soaking, reflow, cooling) automatically with no manual intervention. Compatible with single/double-layer PCBs and various packaging formats (CHIP, SOP, PLCC, QFP, BGA), plus fits Φ110mm exhaust pipes for hassle-free setup.
• Spacious 180×235mm Welding Area & 800W Power – Accommodates PCBs up to 7.08×9.25 inches, expanding application scope while saving costs. Features 8 preset temperature curves + customizable forced heating/cooling for versatile soldering needs.
• Precise Temperature Control (0–280℃) – Equipped with fast infrared heating and uniform temperature fan for consistent, accurate results. Cycle time adjustable from 1–8 minutes; supports custom curve programming (curves 7–8) for specific solder paste requirements.
• Compact & User-Friendly Design – Lightweight desktop model saves workspace; intuitive LCD display + visual drawer design lets you monitor progress easily. Includes a straightforward instruction manual—ideal for beginners and professionals alike.
• Multifunctional All-in-One Solution – Integrates reflow soldering, drying, insulation, shaping, and rapid cooling. Suitable for PCB maintenance, adhesive curing, thermal aging, and both lead/lead-free processes—perfect for hobbyists, workshops, and small enterprises.

model number: T962

Package Dimensions: 15.2 x 14.6 x 9.8 inches